Non Eurocard Prototyping Boards

This is a range of products do not conform to the pre set Eurocard format and allow the designer to use a customised space / environment for their application. The Vero Prototyping boards have a range of designs to make prototyping easier. The boards are also available in several materials to suit your budget and as single Sided, Double Sided, or Plated Through Hole designs.

All component holes in the boards are of a 1.02mm nominal diameter and are on imperial or metric pitches depending on the board being used.

The product selection Chart below has been designed to assist you in the choice of products, but if you require assistance please do not hesitate to contact our sales office on sales@verotech.co.uk for assistance.

Patterns Available:

• Microboards.
• 3 Plane High Density DIP (Dual in Line Package) Pattern.
• Square Pad Boards with and Without ground planes.

DIP Plug in board:

This product is for use with card edge connectors for interfacing with the electronics on the card. the board is a low density board for hard wiring of integrated circuits, particularily useful in R & D applications. 0V and Vcc rail patterns are duplicated on both sides of the board giving increased power capacity.

Features:

• Ideal for hard wiring of discrete components.
• Total flexibility.
• Grid print to aid layout
• Integral power and ground bars
• May also be used for wire wrapping.
• Gold plated card edge pattern.
• Test point facility

Material: SRBP.

Copper clad laminate to BS4584 part 5

Maximum working temperature 97 deg C

Nom board thickness. 1.6mm

Copper thickness. 35 Micron or 1 oz/ft2

Plain Board:

A fully pierced board designed for prototyping analogue circuitry. Utilising Vero Technologies terminal pins and contacts. This board offers total flexibility for hard wiring of discrete components or wire wrapping sockets or pins.

Features:

• Ideal for hard wiring of discrete components.
• Total flexibility.
• May also be used for wire wrapping.

Material: SRBP.

Copper clad laminate to BS4584 part 5

Maximum working temperature 97 deg C

Nom board thickness. 1.6mm

Copper thickness. 35 Micron or 1 oz/ft2

Dip Breadboard:

A low density board for hard wiring of integrated circuits, particularily useful in R & D applications. 0V and Vcc rail patterns are duplicated on both sides of the board giving increased power capacity. These boards do not have gold plated contacts, therefore offering a cost saving over plug in boards. In place of the edge card contacts individual mounting pads are provided for Vero Technologies terminal pins. Suitable for 7.62mm pitch and 15.24mm pitch IC DIP devices.

Features:

• Ideal for hard wiring of discrete components.
• Total flexibility.
• Grid print to aid layout
• Integral power and ground bars
• May also be used for wire wrapping.

Material: SRBP.

Copper clad laminate to BS4584 part 5

Maximum working temperature 97 deg C

Nom board thickness. 1.6mm

Copper thickness. 35 Micron or 1 oz/ft2

Card Edge Connector

95.10

454.66

DIP Breadboard

DIP Plugin Board